Papers

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1		Improved Resolution of Thick Film Resist(Effect of Pre-Bake Condition) [SPIE]	2		Improved Resolution of Thick Film Resist(Effect of Development Technique) [SPIE]
3		Study on Improved Resolution of Thick Film Resist(Verification by Simulation) [SPIE]	4		厚膜レジストにおけるプリベーク条件が解像性に与える影響 [電子情報通信学会]
5		厚膜レジストにおける現像方法の違いによる解像性の検討 [電子情報通信学会]	6		厚膜レジストの高解像化に関する検討 [電子情報通信学会]
7		In-situ Measurement of Outgassing from Chemically Amplified Resist during Exposure to 248nm Light [Journal of Photopolymer Science and Technology]	8		Study of De-protection Reactions for Chemically Amplified Resist [Journal of Photopolymer Science and Technology]
9		Study of Deprotection Reaction during Exposure in Chemically Amplified Resist for Lithography Simulation [Journal of Photopolymer Science and Technology]	10		Analysis of Deprotection Reaction for Chemically Amplified Resists by Using FT-IR Spectrometer with Exposure Tool [SPIE]
11		Measurements of Parameters for Simulation of Deep UV Lithography Using a FT-IR Baking System [SPIE]	12		Analysis of Deprotection Reaction in Chemically Amplified Resists Using an Fourier Transform Infrared Spectrometer with an Exposure Tool [Japanese Journal of Applied Physics]
13		Measurement of Parameters for Simulation of 193nm Lithography Using Fourier Transform Infrared Baking System [Japanese Journal of Applied Physics]	14		Study of Proximity Lithography Simulations Using Measurements of Dissolution Rate and Calculation of the Light Intensity Distributions in the Photoresist [SPIE]
15		Development of Analysis System for F2-Excimer Laser Photochemical Processes [SPIE]	16		Resist Metrology for Lithography Simulation, Part 2: Development Parameter Measurements [SPIE]
17		Approach for High-resolution of Chemically Amplified Resists Using Rate Editor Software [The Japan Society of Applied Physics]	18		Development of Photochemical Analysis System for F2-Excimer Laser Lithography Processes [The Japan Society of Applied Physics]
19		厚膜レジストにおける実測溶解速度を用いたプロキシミティ・リソグラフィ・シミュレーションの検討 [電気学会論文誌]	20		ホトリソグラフィ用化学増幅レジストのシミュレーションパラメータの推算 [電子情報通信学会]
21		P.E.B.プロセスにおけるホトレジストの感光剤の拡散長の推算 [電子情報通信学会]	22		ホトレジスト現象パラメータ測定システムの開発 [電子情報通信学会]
23		ホトレジストの感光パラメータ（A,B,C）測定装置の開発 [電子情報通信学会]	24		ホトリソグラフィにおける実測溶解速度を用いたデフォーカスシミュレーションの検討 [電子情報通信学会]